Description
Brand name: XVTECH
Product name: Semiconductor equipment parts
Available materials: steel, aluminum, alloy, brass, copper, bronze, titanium, PEEK, nylon, acrylic, magnesium alloy, carbon fiber, acrylic, etc.
Size: 200*200*12 (mm)
Tolerance: +/-0.01mm
Surface roughness: Ra0.4-3.2
Surface treatment: anodizing, brushing, chrome plating, hot spray zinc, laser engraving, screen printing, polishing, powder spraying, etc.
Quality requirements: two-dimensional detection, three-coordinate measuring machine, quality inspection report can be provided.
Certification: ISO9001 international certification
Processing equipment: CNC machining center, CNC lathe, five-axis machining center, turning and milling compound
Minimum order quantity: 1 piece
Supply capacity: 200,000 pieces/week
Customization: Customized service is acceptable
Application scenario: Semiconductor equipment parts are crucial in the entire process of semiconductor manufacturing. In the photolithography process, high-precision lenses and mask-bearing parts ensure accurate reproduction of patterns; in the etching process, reaction chamber parts made of special materials are resistant to strong corrosion and ensure uniform etching; when encapsulating chips, fine lead frame parts realize electrical connection of chips, helping to create high-performance semiconductor products.
Product description: This semiconductor equipment part is manufactured by ultra-precision processing technology, with dimensional accuracy at the nanometer level, suitable for high-integration semiconductor production. The material selection is exquisite, and high-purity special materials are mostly used, which have excellent electrical conductivity, thermal conductivity and chemical stability, can withstand harsh manufacturing environments, ensure stable operation of equipment, and help chip manufacturing efficiency and precision.
Product advantages: Semiconductor equipment parts have significant advantages. Precision manufacturing technology realizes ultra-fine microstructure processing, which meets the high-resolution requirements of chip production. Selected special materials have excellent thermal stability and chemical tolerance, can work stably in extreme environments such as high temperature, strong acid and alkali, greatly reduce equipment failure rate, and improve semiconductor production efficiency and product yield.
Packaging: standard wooden box, carton packaging
Sales unit: single piece
Single piece packaging size: 5X5X5 cm
Single piece gross weight: 0.100 kg
